What do you see in the picture of the integrated circuit wafer above and right?

Here at TAG we see the process related imperfections that are telegraphed by the colored banding -- the variations in oxide thickness, etc. which result in variations in active and passive component parameters.

It is our job to produce integrated circuit designs which will be as tolerant as possible to variations in parameters caused by process variations, temperature, radiation, and other factors including manufacturing at foundries with widely different fabrication processes. This is a particularly challenging task for our chosen area of specialization -- linear and mixed signal very-large-scale-integrated-circuit design. But it must be accomplished to achieve high yield and profitability for commercial devices and reliable operation in hostile environments for military/aerospace products.

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THIS SITE WAS LAST UPDATED ON:         02/06/02 18:36

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