What do you see in the picture of the integrated circuit wafer
above and right?
Here at TAG we see the process related imperfections that are
telegraphed by the colored banding -- the variations in oxide thickness, etc. which result
in variations in active and passive component parameters.
It is our job to produce integrated circuit designs which will be
as tolerant as possible to variations in parameters caused by process variations,
temperature, radiation, and other factors including manufacturing at foundries with widely
different fabrication processes. This is a particularly challenging task for our chosen
area of specialization -- linear and mixed signal very-large-scale-integrated-circuit
design. But it must be accomplished to achieve high yield and profitability for commercial
devices and reliable operation in hostile environments for military/aerospace products.
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